Customization: | Available |
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Characteristic: | Stable Electrical Behavior, Low Weight, High Capacitance |
Protection: | Resistance to Corrosion, High Melting Point |
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Tantalum is ductile, superconductive, has high-temperature strength, low thermal expansion, and high capacitance. It is tough, durable, and ductile, tantalum also offers good workability and weldability. In addition, it possesses the ability to grow uniform and stable oxides with good dielectric properties. Tantalum has excellent resistance to corrosive attack by acids and liquid metals.
R05200 is a high-purity tantalum produced using electron-beam furnace or vacuum-arc melt methods or both. The former method involves vaporizing a tantalum wire and depositing it on a water-cooled copper plate to form ingots, while the latter method induces an electric arc between two tungsten electrodes inside a vacuum chamber to melt and solidify the tantalum. Both techniques result in a highly purified, dense tantalum ingot, which can be further processed into various shapes and forms. One of the advantages of these methods is that they yield a material with low oxygen content, typically less than 0.015% by weight. This attribute makes R05200 suitable for applications that require high chemical inertness, such as chemical processing equipment and medical implants.
The following table shows the chemical composition of grade RO5200.
Carbon | Oxygen | Nitrogen | Hydrogen | Niobium | Iron | Titanium | Tungsten | Molybdenum | Silicon |
0.010 max | 0.0150 max | 0.010 max | 0.0015 max | 0.100 max | 0.010 max | 0.010 max | 0.05 max | 0.020 max | 0.0050 max |
Grade | UNS | DIN | EN | AMS | ASTM | JIS | |
RO5200 |
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ASTM B 365
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- |
Thermal Conductivity: BTU-in/hr-ft²-°F (W/m•K)
68-212 °F (20-100 °C): 384 (55.3)
Mean Coefficient of Thermal Expansion: µin/in-°F (µm/m-°C)
68-932 °F (20-500 °C): 3.60 (6.48)
Modulus of Elasticity: KSI(MPa)
27 x 10³ (186 x 10³) in tension
Melting Point (approx.): 5463°F (3017°C):
Difference between R05200 and R05400 Tantalum
In terms of specific differences, R05200 and R05400 vary significantly in their chemical composition, processing method, and properties. One of the most noticeable distinctions between the two is their oxygen content. While R05200 contains much less oxygen, which helps to enhance its corrosion resistance and electrical conductivity, R05400 may have slightly higher concentrations of impurities that affect its mechanical behavior. Another difference is in their grain structure and texture. R05200 typically features a large-grained, columnar structure aligned with the ingot axis, while R05400 possesses a fine, equiaxed grain structure that depends on the powder particle size and compaction conditions.
Moreover, R05200 has an advantage in terms of size and shape flexibility. It can be drawn into thin wires, rolled into sheets, or machined into complex shapes using conventional metalworking techniques. In contrast, R05400 is typically available as a bulk form, such as rods, bars, or plates and requires advanced processing methods, such as hot isostatic pressing or electron-beam melting, to transform into intricate geometries.
Lastly, it is worth noting that both unalloyed tantalum materials exhibit high thermal stability, biocompatibility, and radiation resistance, making them ideal for use in aerospace, defense, semiconductors, and medical applications. However, the choice of material depends on the specific requirements of each application, including the operating temperature, mechanical and chemical stresses, and dimensional tolerances, among others.
Applications